AccuFocus Analytical Laboratory

Plastic Encapsulated IC

Leadframe delaminations (red) and a package crack contained in this PQFP create significant failure modes.

Ball Grid Array

While these two BGA devices appear visually the same, acoustic inspection reveals significant defects in the right BGA at the die surface (red) and within the substrate (black).

Flip Chip

Voiding in the flip chip underfill (red) exposes the solder bumps to potential electrical and mechanical failure.

Ceramic Chip Capacitors

Ceramic chip capacitors can be fully screened for lot qualification or for production failures when mounted. Bright areas within the ceramic body of the capacitor indicate latent defects and cracks due to manufacturing stress.

Silicon Bonded Wafer

Voids and separations between bonded wafers, and cracks within the wafer, reduce product yield and output efficiency.

MEMS Wafer

The hermetic seal can be compromised by voids between the MEMS devices in the wafer.

IGBT (Insulated-gate bi-polar transistor)

Whether it is a small RF transistor (top) or a large power module (bottom), poor bond coverage at any level can lead to overheating and device failure.